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The company''s microelectronics module potting agents access to national patent

BackPublished:2015/5/6 13:49:49    Click to rate:3661

The company developed microelectronic adhesive potting Bondway 5775, has a high Tg, low stress, the thin ceramic circuit board potting get GF applications. Bondway 5775 is a one-component epoxy adhesive can be applied to the overall potting integrated circuit boards, COB encapsulation, underfill. Integrated circuit board includes LTCC (LTCC) integrated circuit boards, FR4 integrated circuit boards, BT integrated circuit boards, the thickness from 0.1 mm to 3 mm. Adhesives of the present invention is particularly suited for thin, low temperature co-fired ceramic (LTCC) integrated circuit boards (0.05 to 0.3 mm) overall casting for the production of microelectronic function module.

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